http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201425368-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0755 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate | 2013-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fea055a383d9806393ffc222053db69f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43f2c2cfe94a949c4defdc040216cc32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8eed1ae07f64b9b1837a241ff52ab17f |
| publicationDate | 2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201425368-A |
| titleOfInvention | Photosensitive resin composition, resist laminate, and cured products thereof |
| abstract | The present invention provides a photosensitive epoxy resin composition capable of forming an image having fine resolution, low stress, and moist heat resistance, and/or the resist laminate, which can be formed by a vertical sidewall shape by photolithography. And the purpose of their hardened materials. The present invention is a reactivity containing (A) an epoxy resin, (B) a polyphenol compound having a specific structure, (C) a photocationic polymerization initiator, (D) an epoxy group-containing decane compound, and (E) a specific structure. a photosensitive resin composition of an epoxy monomer, wherein the (A) epoxy resin contains an epoxy resin (a) obtained by reacting a phenol derivative represented by the following formula (1) and an epihalohydrin, and The epoxy resin (b) represented by the following formula (2): wherein the (E) reactive epoxy monomer is a photosensitive resin composition of a polyoxyalkylene glycol diepoxypropyl ether. |
| priorityDate | 2012-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 157.