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filingDate 2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_548a5844287561f8ebe2b83105cc0ab4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5087822fa36e0602f57cc0c4e0d5a92
publicationDate 2014-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201423945-A
titleOfInvention Use electroless Z-connection
abstract The present invention is an assembly comprising a substrate having a substrate conductor and a contact on a first surface thereof, and a terminal on a second surface for electrically interconnecting the component and the exterior of the component a component, the substrate conductor or the contact is electrically connected to the terminal; a first component, the first surface of the first surface facing the substrate, the first surface of the first surface a conductor, and a second conductor on a second surface, and an interconnect structure extending electrically connected to the first and second conductors through the first component; an adhesive layer, the first component The first surface of the substrate is bonded to each other, at least a portion of the first conductor and the substrate conductor are disposed beyond a side of the adhesive layer; and a continuous electroless metal region is attached to the first conductor The substrate conductors extend between each other.
priorityDate 2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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