http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201421619-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62cde03192748a8ed36c2a5b6b1c608
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e00bc9ecb2995b3ad70eb78611cbb9f
publicationDate 2014-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201421619-A
titleOfInvention Cladding joint structure for preventing creepage contamination
abstract A flip chip bonding structure for preventing creepage contamination is disclosed, comprising a substrate, a bumped wafer, and a filling gel formed between the substrate and the wafer. A plurality of bumps are protrudingly disposed on the flip chip bonding surface of the wafer. When the wafer is flip-chip bonded to the substrate, the bumps are bonded to the pads of the wafer. Wherein, the back surface of the flip chip of the wafer is formed with at least one capillary flow channel, one end of which extends to communicate with the cut side of the wafer to form a flow guiding inlet, thereby preventing the filling colloid from forming an irregular shape on the back surface of the chip. Uplifting agglomeration. Depending on the filling gel, the capillary flow channel also has a corresponding shape change.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111584395-A
priorityDate 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 20.