http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201421584-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate 2013-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c4ea8733ef97034d09e57f4e7526eac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05f2edd467e949fcfb30ffa2aa29413
publicationDate 2014-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201421584-A
titleOfInvention Method for manufacturing mixed substrate and mixed substrate
abstract The present invention relates to a method of manufacturing a hybrid substrate which can be put into a semiconductor manufacturing line, that is, implanting ions from the surface of the ruthenium substrate (1) to form an ion implantation region (3), and implanting ions into the ruthenium substrate. After the surface is bonded to the surface of the sapphire substrate (4) directly or via the insulating film (2), the ruthenium substrate (1) is peeled off in the ion implantation region (3) to obtain ruthenium on the sapphire substrate (4). A method for producing a mixed substrate of a mixed substrate (8) of a film (semiconductor layer) (6), characterized in that the sapphire substrate (4) is heat-treated in a reducing atmosphere and then attached to the ruthenium substrate (1) Hehe.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I785234-B
priorityDate 2012-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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