| abstract |
The present invention provides a structured abrasive article having: a substrate having opposing first and second major surfaces; and a structured abrasive layer disposed on the first major surface of the substrate and secured to The first major surface of the substrate. The structured polishing layer includes a polymeric binder, abrasive particles dispersed in the binder, and an additive dispersed in the binder. The additive provides improved chemical mechanical planarization (CMP) polishing performance including high oxide/nitride selectivity, high removal rates, lower nitride loss, and improved in-wafer heterogeneity (WIWNU). |