| abstract |
An insulating composition for a multilayer printed circuit board comprising: 0.5 to 10 wt% of a nano-clay, 5 to 50 wt% of a soluble liquid crystal oligomer, 5 to 50 wt% of an epoxy resin, and a solvent 5 to 40 wt% and an inorganic filler 50 to 80 wt%, a prepreg and an insulating film using the composition, a multilayer circuit board including a prepreg, and an insulating film as an interlayer insulating layer. Thus, the composition is prepared by mixing nano clay, soluble liquid crystal oligomer (LCO), epoxy resin, and inorganic filler, and the composition has excellent thermal, electrical, and mechanical properties, and can be manufactured as one. The substrate insulating material, such as a prepreg or a film layer, the prepreg or the film layer can achieve a low coefficient of thermal expansion, high rigidity and high thermal characteristics, and can be used as a high-order package substrate. |