| abstract |
The present invention provides a contact lens incorporating a thin wafer wafer, along with a method for assembling the wafer in the contact lens. In one aspect, a method includes forming a plurality of lens contact pads on a lens substrate and forming a plurality of wafer contact pads on a wafer. The method further includes: applying an assembly bonding material to each of the plurality of lens contact pads or wafer contact pads; aligning the plurality of lens contact pads with the plurality of wafer contact pads; using flip chip bonding, Bonding the wafer to the lens substrate via the assembly bonding material; and forming a contact lens with the lens substrate. |