http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201418527-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_442006254efb98c9cebec6ee5a08d5e8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-34 |
| filingDate | 2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ddb4749b2814493d5c8ce91917162c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b01b5e373dff3d77ff1ed3d778e9de1e |
| publicationDate | 2014-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201418527-A |
| titleOfInvention | Electroplated copper hole filling inhibitor and electroplating copper filling formula for through hole (TSV) |
| abstract | A through-hole (TSV) electroplated copper hole-filling inhibitor and a copper-plated hole-filling formula, in which a functional polyalcohol (polyfunctional Polyethylene Glycols) is used as an inhibitor in a TSV filling solution formulation. Compared with the traditional inhibitor Polyethylene glycol (PEG), the PEG derivative-based inhibitor of the present invention exhibits less dosage and stronger inhibition ability in the TSV electroplating copper hole filling experiment. The plating solution can be used without the use of a leveling agent. The experimental results show that the PEG derivative is used as an inhibitor of the hole-filling formula, and the Bottom Up and the non-porous superfilling can be expressed in the through-hole. mode. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113481553-A |
| priorityDate | 2012-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.