| abstract |
The present invention provides a metal material for electronic parts having low insertion and removal properties, low whisker properties and high durability, and a method for producing the same. The metal material 10 for electronic parts according to the present invention includes a substrate 11, an A layer 14, and a B layer 13 which constitute the outermost layer of the substrate 11 and are formed of an alloy of Sn, In or the like; The B layer 13 is disposed between the substrate 11 and the A layer 14 to form an intermediate layer, and is formed of an alloy of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir, or the like; and the outermost layer (layer A) The thickness of 14 is thicker than 0.2 μm, and the thickness of the middle layer (layer B) 13 is 0.001 μm or more. |