http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201414383-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f7f120efe096284c7389702c969cf3d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0156 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0014 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2013-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1c6bc2704737401052bcdd3ee01d475 |
| publicationDate | 2014-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201414383-A |
| titleOfInvention | Circuit board manufacturing method |
| abstract | A method of manufacturing a circuit board, comprising: forming a photoresist pattern 20 formed of a photoresist on a support 10 to obtain a photoresist pattern support; and the foregoing a step of forming the curable resin composition layer 30 composed of the curable resin composition on the resist pattern 20, a step of laminating the substrate 40 on the curable resin composition layer 30, and constituting the curable resin composition layer The curable resin composition of 30 is cured so that the curable resin composition layer 30 becomes the cured resin layer 30a; and the support 10 is cured from the above before or after the curable resin composition is cured. a step of peeling off the resin composition layer 30 or the cured resin layer 30a and the photoresist pattern 20; removing the photoresist pattern 20 from the hardened resin layer 30a by peeling or dissolving the photoresist pattern 20 to form a step of curing the resin layer of the uneven structure; and a step of forming the fine wiring 50 by plating in the concave portion of the uneven structure formed by the cured resin layer 30a. |
| priorityDate | 2012-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 183.