| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44b2ac87aeadb161b83426d9cf6c4bdc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2013-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d02f64900d0d432772d0f39cfa80bf37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed82c695d07eb8b4d4c94b05f46521de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_439cf7033d6437e03bf5376103cf0f73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab200b8b2f2b1cb28590e01d90d037c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38a920f463505363a52813371a3575dc |
| publicationDate |
2014-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201413902-A |
| titleOfInvention |
Terminal structure and semiconductor component and module substrate therewith |
| abstract |
A preferred terminal structure of the present invention comprises: a substrate; an electrode formed on the substrate; and an insulating coating layer formed on the substrate and on the electrode and having an opening for exposing at least a portion of the electrode; a metal layer having a surface formed on an upper surface of the insulating coating layer on a peripheral portion of the opening so as to be formed in a region in the opening of the electrode, and comprising Ni; and a dome-shaped bump formed The region in the opening on the underlying metal layer of the bump includes Sn and Ti; and the end of the boundary between the under bump metal layer and the bump contacts the inner wall of the opening portion of the insulating coating layer. |
| priorityDate |
2012-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |