| abstract |
The invention provides a direct connection structure of a bump wire and a manufacturing method thereof. The bump wire direct connection structure comprises: a contact component is supported by an integrated circuit; a bump under metallization layer (UBM) feature is electrically coupled to the contact component; and a metal trapezoidal bump is disposed under the bump metal Above the UBM feature, wherein the metal trapezoidal bump has a first tapered cross section; and a substrate conductor is disposed on the metal trapezoidal bump, wherein the substrate lead has a second tapered cross section. And coupled to the metal trapezoidal bump by a direct metal-to-metal bonding process. |