| abstract |
A semiconductor package substrate having a pillar and related methods. The substrate includes a first dielectric layer, a first circuit pattern, a plurality of pillars and a second circuit pattern. The first dielectric layer has a first dielectric surface and a second dielectric surface. The first circuit pattern is buried in the first dielectric layer and defines a plurality of curved trace surfaces. The cylinders each have an outer surface and a curved base surface, wherein the outer surface is used to make an external electrical connection, and the surface of the curved base abuts a corresponding one of the surface of the trace. The second circuit pattern is located on the second dielectric surface of the first dielectric layer and electrically connected to the first circuit pattern. |