http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201412967-A

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filingDate 2013-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05cccdeec0770e8f9ff2f1d152040284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8e78fc627b33efd456db219913454eb
publicationDate 2014-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201412967-A
titleOfInvention Thermally conductive sheets and electronic machines
abstract The solution of the present invention resides in a thermally conductive sheet characterized in that a thermally conductive resin layer is laminated on one surface or both surfaces of a heat conductive layer, and the thermal conductivity in the thickness direction is 1.5 W/mK or more, and the thermal conductivity in the in-plane direction is divided by The value after the thermal conductivity in the thickness direction is 2 or more. The heat conductive sheet of the present invention is formed by laminating a heat conductive resin layer for reducing contact heat resistance on one side or both sides of the heat conductive layer, thereby improving adhesion between the heat conductive resin layer and the heat generating body, and reducing contact thermal resistance. , quickly transfer heat to the heat transfer layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3310142-A4
priorityDate 2012-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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