http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201412217-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-068 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2013-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a633fd9616df953cb80d71f5b70943b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e63d8344f3180bf354de012373aa4ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da |
| publicationDate | 2014-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201412217-A |
| titleOfInvention | Multilayer printed wiring board manufacturing method |
| abstract | The present invention provides a method for producing a multilayer printed wiring board having a high glass transition temperature and a low linear thermal expansion coefficient and capable of suppressing voids and having an insulating layer having a uniform film thickness. The method for producing a multilayer printed wiring board comprising the steps of: (A) heating and pressurizing a prepreg with a support on an inner layer circuit substrate for vacuum lamination; and (B) heating the prepreg a step of forming an insulating layer by curing, wherein the prepreg contains a curable resin composition and a sheet-like fibrous base material, and the content of the curable resin composition in the prepreg is 30% by mass or more and 85% by mass or less. The curable resin composition contains an inorganic filler. In the step (A), the degree of vacuum at the time of lamination is 0.001 to 0.40 kPa, the time to reach the vacuum is 15 seconds or less, and the pressurization at the time of lamination is 1 to 16 kgf/ Cm2, the heating temperature at the time of lamination is 60 to 160 ° C, and the time for lamination is 10 to 300 seconds. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I698481-B |
| priorityDate | 2012-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.