| abstract |
The invention relates to a method of joining a first contact zone (3) of a first at least substantially transparent substrate (1) to a second contact zone (4) of a second at least substantially transparent substrate (2), Bonding is performed on at least one of the contact regions using an oxide to form an at least substantially transparent interconnect layer (14) on the first and second contact regions (3, 4) having at least 10e1 Conductivity of S/cm2 (measurement: four-point method, relative to 300K temperature) and light transmittance greater than 0.8 (for wavelength range from 400 nm to 1500 nm). |