| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f76aab74ed312003383a8600e2edbd5b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2013-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a8b4609d8c6978588b1455a12eb43ff |
| publicationDate |
2014-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201410778-A |
| titleOfInvention |
Liquid compression molding encapsulant |
| abstract |
The present invention provides a thermosetting resin composition for liquid compression molding of a packaged wafer. Such encapsulated germanium wafers have improved warpage resistance compared to unpackaged wafers or wafers packaged with known packaging materials. |
| priorityDate |
2012-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |