| abstract |
A package structure includes: a first substrate having a first region and a second region, and including a metal pad on the first substrate in the first region; a first metal pillar on the metal pad; and a passivation layer in the second region And a second metal pillar on the passivation layer in the second region; and a second substrate including the first connector and the second connector; wherein the first substrate is bonded to the second substrate, wherein a first soldering region is formed between the first metal pillar and the first connector, a second soldering region is formed between the second metal pillar and the second connector; and wherein the thickness of the first metal pillar is greater than the thickness of the second metal pillar thickness. |