| abstract |
The present invention relates to a positive photosensitive resin composition and a method of forming the same. The positive photosensitive resin composition contains a novolac resin (A), an ester of an o-naphthoquinonediazidesulfonic acid (B), a dye (C), and a solvent (D). The novolak resin (A) described above contains a hydroxy novolak resin (A-1) obtained by condensing a hydroxybenzaldehyde compound with an aromatic hydroxy compound. The above dye (C) comprises at least one (C-1) selected from the group consisting of a disazo dye, an anthraquinone dye, and a trivalent chromium azo dye, and a triarylmethane dye (C). -2). The positive photosensitive resin composition can form a fine color developing pattern on the metal wiring, and the color does not fall off after etching, which is advantageous for shielding the reflected light of the metal wiring. |