| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_df9c393a770b8892e50718d2b4df2e5d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea260c774f2f5492b2e4276f43b1ba19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc854c175f4f7674b9ed3cbb865e3672
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09434da76e5feeb57a8015e2493a6513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ff0cd73fe6a066f18702c7498542ee5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15dca0e03ef4d87e172ff18ce7e288e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_173ba7589445c8cee251def9abca455e |
| publicationDate |
2014-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201408749-A |
| titleOfInvention |
Mask sheet for manufacturing semiconductor device and method of manufacturing semiconductor device using same |
| abstract |
The requirements as a mask sheet are as follows: it can be attached to the L/F at a lower temperature than the thermoplastic mask sheet, and it is difficult to cause an adhesive residue such as when the mask sheet is peeled off even when exposed to a high temperature. Thermal deterioration, flatness and small warpage. It is harder and has better W/B properties than conventional adhesive mask sheets at high temperatures. The molded resin leaks less than the adhesive mask sheet during sealing, even after passing through the plasma. The washing step is still a mask sheet having weak peelability and less adhesive residue. The present invention relates to a mask sheet for manufacturing a semiconductor device in which an area layer of a base material layer is thermally cured and adhered to a metal plate, and the thermosetting adhesive layer contains a polyimide resin and a ring. An oxygen resin, a hardener, and a fluorine additive, and the polyimide resin has a glass transition temperature of 45 to 170 ° C and contains a rhodium skeleton. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11322431-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I724104-B |
| priorityDate |
2012-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |