http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201405878-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed76131ddda07950fa9ba87fba15eeb6 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate | 2012-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ceb3be9b60184261e21deabd52aee2c7 |
| publicationDate | 2014-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201405878-A |
| titleOfInvention | Light emitting diode package structure |
| abstract | A light emitting diode package structure includes a bracket, a light emitting diode chip, and a reflective cup. The bracket has an upper surface. The light emitting diode chip is disposed on an upper surface of the bracket. The reflector cup is disposed on the upper surface of the bracket and surrounds the LED chip. The material of the reflector cup is a plastic having a decalin structure. The plastic having the decalin structure has high resistance to high temperature and is not easily deteriorated, so the reflector made of plastic having a decalin structure also has good high temperature resistance. Therefore, the LED package structure can withstand high temperature, has good stability, and has a long service life. |
| priorityDate | 2012-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.