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filingDate 2013-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e817d5fc18e85b950a681491cd49cd64
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publicationDate 2014-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201405677-A
titleOfInvention Semiconductor device manufacturing method
abstract A method of manufacturing a semiconductor device according to the present invention includes a preparation step of preparing a substrate on which a recess is formed, a terminal disposed in or around the recess, and a semiconductor element disposed in the recess; and a wire bonding step of connecting the terminal with a metal wire And a semiconductor component; a pressure bonding step of pressing the sealing sheet against the upper surface of the concave portion and being spaced apart from the upper surface of the concave portion in a reduced pressure environment; and an atmospheric liberation step of the substrate Freeze with the sealing sheet in an atmospheric environment.
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