| abstract |
A semiconductor package is formed by forming a bonding unit on each of the crystallizing regions of a carrier member such that each of the bonding units is located on each of the crystallographic regions, and then mounting a semiconductor component on the bonding unit, and then forming An insulating layer is disposed on the carrier and the semiconductor elements, and a wiring layer is further formed on the insulating layer to electrically connect the semiconductor element. The bonding unit is only formed on each of the crystallizing regions, and the entire surface is not disposed on the carrier. Therefore, when the temperature changes, the bonding unit does not expand and contract, thereby avoiding the offset of the semiconductor component. . The present invention provides the semiconductor package. |