| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-64 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 |
| filingDate |
2013-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_239e8b7e7a3f6c2bdd5f6950353d9da4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_017f4fb405e1337f088fcb4f01cd98f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e4ab0cfb57f9c65ec8ea1d05fe7dbbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c20d5e2d65fa50efa3d395160e989d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_490dba7b40de8d947f82465f93a11467 |
| publicationDate |
2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201402879-A |
| titleOfInvention |
Electroplating bath and method |
| abstract |
The present invention discloses a tin-silver alloy plating bath having certain amine oxide surfactants and a method of electrodepositing a tin-silver containing layer using such baths. Such electroplating baths can be used to provide tin-silver solder deposits with reduced void formation and improved grain internal consistency. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I548782-B |
| priorityDate |
2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |