http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201402747-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4308752e855a46f4a236d7230610c13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c37617a935280e521bc8a0e2185ad8c |
| publicationDate | 2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201402747-A |
| titleOfInvention | Semiconductor device and method of manufacturing the same |
| abstract | The present invention relates to a liquid resin composition for an adhesive, which comprises at least a solvent (A), an epoxy resin (B) having two or more epoxy groups in one molecule, and two or more phenolic compounds in one molecule. a hydroxyl group epoxy resin hardener (C) and a hardening accelerator (D), characterized in that the epoxy resin (B) and the epoxy resin hardener (C) are dissolved in the solvent (A); The curing accelerator (D) dissolves the epoxy resin (B) and the epoxy resin curing agent (C) in the solvent at a temperature ranging from normal temperature to a temperature at which the solvent (A) is volatilized ( In the varnish (W) of A), and in the adhesive layer obtained by volatilizing the solvent (A) from the varnish (W), it is present in a visually observable size, and the solvent (A) is volatilized from the solvent In the temperature range from the temperature at which the temperature is high to the curing temperature, it is a size that cannot be visually observed or dissolved in the adhesive layer. According to the present invention, it is possible to provide a liquid resin composition for an adhesive which is excellent in continuous printing property at the time of printing, has good semiconductor element mountability after solvent evaporation, and has no adhesive at room temperature. |
| priorityDate | 2007-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.