| abstract |
The present invention provides a temporary adhesive for manufacturing a semiconductor device, and a method for producing a semiconductor device, which is used for mechanical treatment or chemical treatment of a member to be processed (such as a semiconductor wafer). At the time of processing, the member to be processed can be temporarily and reliably supported, and the temporary damage to the processed member can be easily released without causing damage to the processed member. A temporary adhesive for manufacturing a semiconductor device, a contact support using the same, and a method for producing a semiconductor device, wherein the temporary adhesive for semiconductor device production includes: (A) a resin, (B) a crosslinkable compound, and (C) a solvent (D) a reaction initiator, and (E) a sensitizing dye. |