| abstract |
An object of the present invention is to provide a circuit forming method for a printed wiring board, a thermosetting resin composition, and a printed wiring board which do not require a pre-plating treatment process and are formed on a plating film or a conductive coating film. In the polishing process of the metal, a fine circuit can be formed, and the processability of the laser irradiation to the insulating resin layer and the adhesion between the insulating resin layer and the circuit film are good. According to the present invention, there is provided a method of forming a circuit for a printed wiring board, comprising: a structure for forming a concave portion, and an insulating resin layer having ultraviolet absorbing properties on a metal foil laminated plate, with pulse enthalpy The second-order ultraviolet laser is irradiated, thereby removing the insulating resin layer to form a concave portion structure; and the dispersion coating process, coating the metal nanoparticle by inkjet method inside the concave portion structure formed by the recess structure formation process Dispersion. |