| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_97730cc5065bbf9bf0a8e17abab99164 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31692
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L57-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L45-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2012-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e112d146fd06d548bf31b11290a0200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fed5d9645f8632d001df2e30f57a4ff0 |
| publicationDate |
2014-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201400547-A |
| titleOfInvention |
Low dielectric resin composition and copper foil substrate and printed circuit board using the same |
| abstract |
The present invention provides a resin composition comprising: (A) 100 parts by weight of a terminal styryl polyphenylene ether resin; (B) 5 to 75 parts by weight of an olefin copolymer; and (C) 1 to 150 weight A portion of a polyphenylene ether functional group-containing cyanate resin. The present invention can be made into a semi-cured film or a resin film by including a specific component and ratio so as to achieve a low dielectric constant, a low dielectric loss and a high heat resistance, thereby being applicable to a copper foil substrate. And the purpose of the printed circuit board. |
| priorityDate |
2012-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |