Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1837840b0d7f1d216335a0331a4bd15a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S516-925 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L93-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
filingDate |
2013-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0053dc783efb333134964098b827af5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76ee7e382044875d3ef002b5f7f3492f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_300bbfbc0ffdeaf84ef0ace8fce45a24 |
publicationDate |
2014-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201400226-A |
titleOfInvention |
Base resin for soldering flux, solder flux and solder paste |
abstract |
An object of the present invention is to provide a novel base resin for solder flux which can improve the fluidity of the flux and the viscosity stability and adhesion of the solder paste, and the color tone and crack resistance of the flux residue are also good. The present invention relates to a base resin for soldering flux, which is composed of a rosin (A) containing the following components: at least 15% by weight of a hydantoin-type resin acid (a-1), and a half-day alkane-type resin acid (a-2) At least 1% by weight and at least 50% by weight of the rosin-type resin acid (a-3) having no conjugated double bond. |
priorityDate |
2012-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |