| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03914
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0384
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05564
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1184 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-522
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2013-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_964e42227fcf22772959de2694cd4b4a |
| publicationDate |
2013-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201349427-A |
| titleOfInvention |
Flattened semiconductor structure and method across multiple electrical conductor posts |
| abstract |
Some embodiments include a planarization method. A liner is formed across a semiconductor substrate and along a column extending upwardly from the substrate. An organic filler material is formed on the liner and between the columns. Forming a planarized surface extending across the columns and across one or both of the liner and the filler material. Some embodiments include a semiconductor structure that includes a semiconductor die. An electrical conductor post extends through the die. The posts have an upper surface above one of the backside surfaces of the die and have sidewall surfaces extending between the backside surface and the upper surfaces. A liner traverses the backside surface of the die and along the sidewall surfaces of the pillars. Electrical conductor covers are located on the upper surfaces of the posts and have edges along the liner adjacent the sidewall surfaces of the posts. |
| priorityDate |
2012-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |