| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-10697 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-06 |
| filingDate |
2012-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10bc51e54cc0b555cb3f0d213458f3e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef066b984a9b05950c5fd9283d21b55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1bb69d6fb8cbe3cebe46b3a7dcce5e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98ec5a0ec5b2f3f84153d88560283eeb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66c6ea75407f8031d1c2decdcb39d374 |
| publicationDate |
2013-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201347622-A |
| titleOfInvention |
Manufacturing method of laminated body, laminated board, multi-layer laminated board, printed wiring board, and laminated board (2) |
| abstract |
A laminated body comprising one or more resin composition layers and one or more glass substrate layers, wherein the resin composition layer is composed of a resin composition containing a thermosetting resin and In the inorganic filler, the glass substrate layer is 10 to 95% by volume based on the entire laminate. A laminated board comprising one or more resin cured material layers and one or more glass substrate layers, wherein the resin cured material layer is composed of a cured product of a resin composition containing thermosetting In the resin and the inorganic filler, the glass substrate layer is 10 to 95% by volume based on the entire laminate. A printed wiring board having the above laminated board and wiring, the wiring being disposed on a surface of the laminated board. A method for producing a laminated board, wherein the laminated board is a laminated board, and the method for producing the laminated board comprises the step of forming a cured resin layer, wherein the step of forming a cured resin layer on the surface of the glass substrate. |
| priorityDate |
2011-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |