| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d0693ed4f2b7b1fab97515ac2f1f311c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16503
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05541 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5543fabc0b7a5c7073e00cdde6528c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab8369fe8858ef571a2a152178d14f59 |
| publicationDate |
2013-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201347111-A |
| titleOfInvention |
Electrical connection structure containing Cu6Sn5 crystal grains with preferred direction growth and preparation method thereof |
| abstract |
The present invention relates to an electrical connection structure comprising Cu6Sn5 crystal grains having a preferred direction of growth and a preparation method thereof. The method for preparing an electrical connection structure of the present invention comprises the steps of: (A) providing a first substrate; (B) forming a first nano-twinned copper layer on a portion of the surface of the first substrate; (C) using a solder Connecting the first substrate to a second substrate, the second substrate has a second electrical pad, the second electrical pad comprises a second nano-copper layer, and the solder is disposed on the first and second nano-double Between the copper layers; and (D) reflowing at a temperature of 200 ° C to 300 ° C to convert the solder portion into an intermetallic compound (IMC) layer, and the intermetallic compound layer includes a preferred orientation (Preferred orientation) Cu6Sn5 grains grown; wherein, more than 50% of the volume of the first and second nano twin copper layers respectively comprise twinned copper grains. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I709667-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11242619-B2 |
| priorityDate |
2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |