http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201346445-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e14243074ead50ebb782b5cfe1a2034e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0046 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-08 |
| filingDate | 2013-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1975ccc264a2d0cc0c868023c6d30f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29b5ff8a13f2cc04511e71ff204d4d33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25df436b9758f4780c11007c06c50761 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc1169cad545beb35a98e0210c85ed14 |
| publicationDate | 2013-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201346445-A |
| titleOfInvention | Photosensitive polymer resin for thick layer and resin composition containing the same |
| abstract | A photosensitive polymer resin for a thick layer and a resin composition comprising the resin, and more particularly, a photosensitive polymer resin for a thick layer and a resin composition comprising the resin, wherein The photosensitive polymer resin is suitable for use in photosensitive etching processes such as bump formation, wiring formation, and fabrication and processing of an interlayer insulating layer, a circuit protection film, and precision parts, which are manufactured on a circuit board. And the installation of semiconductor or electronic components is performed in a program on the circuit board. The photosensitive polymer resin is a polymer resin comprising a divalent anthracene derivative and a tetravalent organic group in its main chain and having a specific acetal protecting group. The polymer resin can be used as a negative photosensitive resin composition by mixing with a photoacid generator and a photoactive compound as a positive photosensitive resin composition or a photopolymerization initiator. |
| priorityDate | 2012-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 164.