Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 |
filingDate |
2009-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f92e8c9b3b9dca340cf10074fdb60bdb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_490dba7b40de8d947f82465f93a11467 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fedf721c4a24d3066b3235208c3514f |
publicationDate |
2013-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-201343981-A |
titleOfInvention |
Lead-free tin alloy plating composition and method |
abstract |
The present invention discloses an electrolyte composition for depositing a tin alloy on a substrate. The electrolyte composition includes tin ions, ions of one or more alloy metals, a flavonoid compound, and a dihydroxy disulfide. The electrolyte composition is free of lead and cyanide. The invention also discloses a method of depositing a tin alloy on a substrate and a method of forming interconnect bumps on the semiconductor device. |
priorityDate |
2008-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |