| abstract |
The invention relates to an aromatic polyimide film, a preparation method thereof and an application thereof, wherein the aromatic polyimide film has a linear thermal expansion coefficient of about 5 ppm/° C. at 50° C. to 500° C. The composition of the body: an aromatic dianhydride; a first aromatic diamine selected from the group consisting of formula (I) and formula (II): □ □ wherein, X and Y of formula (I) or formula (II) Each is selected from the group consisting of an oxygen atom (O), a nitrogen atom (N) or a sulfur atom (S), and R and R' are respectively selected from NH2, □ or □; and an optional second aromatic diamine is selected from the group consisting of a group of p-phenylenediamine, 4,4'-oxydiphenylamine, 3,4-diaminophenyl ether, diaminodiphenyl hydrazine, 4,4'-diaminotriphenylamine or A variety. |