| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e9059c03350380e5577b50d44e3f4b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2013-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31849d8be6c46881ce1d742d5eb1e913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e352bc6abbdcf6967ba2bb34d01985d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_127e1bafd86f34821cefa67c184ae221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_979fec54d54dde2bf51717a466a5debf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89f81553ae58c77d486fad57141cdc55 |
| publicationDate |
2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201343011-A |
| titleOfInvention |
Method for manufacturing double-sided printed circuit board |
| abstract |
A method of manufacturing a double-sided printed circuit board is provided. In the method, a first conductive circuit pattern for arranging a circuit is formed on an upper side of an insulating layer, and a second conductive circuit pattern for arranging a circuit is formed on a lower side of the insulating layer. . Forming a through hole vertically through the insulating layer, and forming a conductive material on an inner peripheral surface of the through hole, so that the first circuit pattern and the second circuit pattern are electrically connected by the through hole. |
| priorityDate |
2012-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |