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filingDate 2012-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201339256-A
titleOfInvention Grinding composition
abstract The polishing composition of the present invention used for polishing a polishing object having a portion containing a III-V compound material contains abrasive grains, an oxidizing agent, and a water-soluble polymer. The water-soluble polymer may be one or more of 5,000 or more molecules per 1 μm 2 of the surface area of the abrasive grains after the polishing composition is allowed to stand at a temperature of 25 ° C for one day. Alternatively, it may be a compound in which the water contact angle of the portion of the object to be polished containing the III-V compound material after polishing the object to be polished is polished using the polishing composition.
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