abstract |
The present invention provides a resin composition for sealing an electronic component, which comprises a phenol resin curing agent and an epoxy resin, and the phenol resin curing agent and the epoxy resin have a biphenyl structure; an electronic component seal A resin composition containing a phenol resin hardener and an epoxy resin, a glass transition temperature of the cured product of 200 ° C or more, a weight reduction rate of 0.3% or less; and an electronic device having an electronic component sealed with the above resin composition . |