| abstract |
The present invention discloses a curable and patternable ink, a method of using the ink as part of a structure that can function in an electronic component, and a method for forming the substrate on one of the electronic components Soft lithography method of structure. The curable and patternable ink typically comprises a first portion defined by a (R)SiO3/2 structural unit; a second portion defined by a (R)2SiO2/2 structural unit; and an organic Solvent. Alternatively, the ink further comprises a structural unit (R) 3SiO1/2 or SiO4/2. The R groups independently selected are aryl, methyl, or crosslinkable groups, and the aryl groups are present in an amount ranging from at least one aryl group up to 20 mole %. The patternable ink can be applied to a substrate using a soft lithography method, and the method can reproduce the applied pattern well. |