| abstract |
The present invention provides a resin composition which, when used as a material of an insulating layer of a printed circuit board, can form a roughened surface having a low roughness on the surface of the insulating layer without being subjected to roughening conditions, and between the insulating layer and the plated conductor layer It is excellent in adhesion, low in thermal expansion coefficient (linear expansion coefficient), high in glass transition temperature, and excellent in moisture absorption and heat resistance. A resin composition comprising an epoxy compound (A), a cyanate ester compound (B), and an inorganic filler (C), the cyanate ester compound (B) being selected from the group consisting of naphthol aralkyl type cyanic acid One or more of the group consisting of an ester compound, an aromatic hydrocarbon formaldehyde type cyanate compound, a biphenyl aralkyl type cyanate compound, and a novolak type cyanate compound, and the epoxy compound (A) And the total content of the cyanate compound (B), the content of the epoxy compound (A) is 60 to 75% by mass. |