http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201336341-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c468e687b43595cae7cb1c2667678f1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F27D2099-0065 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B35-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B25-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F27B17-0025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B3-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324 |
| filingDate | 2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7fd5e4386347d42022a268df9f1fed7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c56d7e5133db849a31b9d4f828fdb91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5b730c161f1829d906c4991c1382546 |
| publicationDate | 2013-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201336341-A |
| titleOfInvention | Heater and film forming device |
| abstract | In the heat generation system of the heater, the heat generating body member (2) having a strip-shaped cross section is formed into a basic structure and has a shape capable of securing strength. The heat generating body (1) has a structure in which the heat generating body member (2) is bent in the longitudinal direction, and is formed in a ring shape or a disk shape to constitute a planar heat generating body. The heater having the heating element (1) is applied to the film forming apparatus, and the upper surface (S) of the heating element (1) is disposed below the wafer so as to face the back surface of the wafer. In the heating element (1), the occurrence of deflection can be reduced, and deformation can be suppressed. In the film forming apparatus, heating of the wafer under desired conditions is achieved by a heater having a heating element (1), and uniform heating from the back surface of the wafer can be performed. |
| priorityDate | 2011-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.