http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201336001-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e93c758b48e056647dabacc640e54a63 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2012-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e866760b2f986becde5fffad4e9209df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57e64f296787f4389cc7d45560bdf4e5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ca6ccf470d46c7e1dd7828123be0d63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ffdd505b8f39940101c1d2c46a28103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7e4032f6496a899381cc204bd44d448 |
| publicationDate | 2013-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201336001-A |
| titleOfInvention | Fine pitch bump manufacturing method and structure thereof |
| abstract | A fine pitch bump manufacturing method comprising: providing a germanium substrate; forming a titanium-containing metal layer on the germanium substrate, wherein the titanium-containing metal layer has a plurality of first and second segments; forming a photoresist layer a titanium-containing metal layer; patterning the photoresist layer to form a plurality of trenches; forming a plurality of copper bumps on the plurality of trenches, each of the copper bumps having a first top surface and a ring wall; performing a heating step The photoresist layer is heated to form a plurality of body portions and a plurality of removable portions; an etching step is performed on the photoresist layer to remove the removable portions; and a plurality of bump protection layers are formed on the a first metal layer, a first top surface of the copper bump, and the ring wall; forming a plurality of wettable layers on the bump protection layer; removing the photoresist layer; and removing the titanium-containing metal layer The second sections are formed such that the first sections of the titanium-containing metal layer are formed as an under bump metal layer, and each of the under bump metal layers has a bump bearing portion and an extension portion. |
| priorityDate | 2012-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.