| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0530c14c7a5b9a232bb9e17ec7fa5d16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0514 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 |
| filingDate |
2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14a3fd8da574c397835ac924757fde6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af570e1ec928b1733ed3e280af5e4dd2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36010f586f6a4004194e48a06c57018c |
| publicationDate |
2013-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201333972-A |
| titleOfInvention |
Copper microparticle dispersion, conductive film forming method and circuit substrate |
| abstract |
The object is to provide a dispersion of copper microparticles suitable for discharge in the form of droplets. The copper microparticle dispersion liquid contains copper microparticles, at least one dispersion carrier containing the copper microparticles, and at least one dispersant for dispersing the copper microparticles in the dispersion carrier. The copper microparticles have a central particle diameter equal to or greater than 1 nm but less than 100 nm. The dispersion carrier is a polar dispersion carrier having a boiling point in the range of from 150 °C to 250 °C. Thereby, when the copper fine particle dispersion is discharged in the form of droplets, it is possible to prevent the dried dispersion carrier from blocking the discharge portion and having a high boiling point but low viscosity, so that the copper fine particle dispersion is suitably discharged as droplets. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9615455-B2 |
| priorityDate |
2011-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |