| abstract |
[Problem] A colored photocurable resin composition capable of forming a solder resist layer excellent in masking property due to oxidation of a copper circuit can be provided. [Solution] A photocurable resin composition which can be developed with an aqueous alkali solution, which comprises (A) a resin containing a carboxylic acid, (B) a photopolymerization initiator, and (C) having two or more ethylenic groups in the molecule. a compound of an unsaturated group, and (D) a red colorant. |