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filingDate 2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2013-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201333244-A
titleOfInvention Chemical vapor deposition of tantalum film and its application
abstract The present invention discloses a method for depositing a ruthenium containing film. In some embodiments, a method of depositing a germanium-containing film on a substrate can include: depositing a germanium-containing film on the substrate using the germanium-containing precursor, depositing carbon in the deposited germanium-containing film; and exposing the deposited germanium-containing layer At least some of the carbon is removed from the self-deposited ruthenium containing film in a hydrogen containing gas. In some embodiments, the ruthenium containing film exposed to the hydrogen containing gas may be subsequently exposed to an oxygen containing gas to achieve at least one of: removing at least some of the carbon from the ruthenium containing film; or adding oxygen to the ruthenium containing film. In some embodiments, deposition and exposure to a hydrogen containing gas and, if desired, an oxygen containing gas may be repeatedly performed to deposit a ruthenium containing film to a desired thickness.
priorityDate 2011-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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