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publicationDate 2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201332413-A
titleOfInvention Method of manufacturing a metal printed circuit board
abstract The invention provides a method for manufacturing a metal printed circuit board, the method comprising: printing a circuit pattern on a release film; applying a thermal insulation layer on the circuit pattern; and bonding a thermal conductive layer on the thermal insulation layer And thermally bonding the thermally conductive base layer to the thermally conductive insulating layer; and removing the release film from the circuit pattern.
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