| abstract |
A pattern forming method is provided which comprises (i) a step of forming a film by using a photosensitive ray-sensitive or radiation-sensitive resin composition containing a substance capable of increasing polarity under the action of an acid The resin (A) capable of reducing the solubility of the developer containing the organic solvent can produce an acid compound (B), a solvent (C), and substantially no fluorine atom and germanium atom upon irradiation with actinic rays or radiation. And a resin (D) different from the resin (A), (ii) a step of exposing the film, and (iii) a step of developing by using a developer containing an organic solvent to form a negative pattern. |