http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201331427-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_454bed2bf48045cf286eac0b24ce9574 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
| filingDate | 2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f117124e7777a0fcb349b59aac11a80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b729bd8402162ea6d1eddf2c0a2467e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfd22c443b38b3ec46b8dfec6e6885b2 |
| publicationDate | 2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201331427-A |
| titleOfInvention | Non-cyanide electrolytic gold plating bath for gold bump formation and gold bump forming method |
| abstract | The present invention provides a non-cyanide electrolytic gold plating bath for forming a gold bump suitable for bump hardness and a bump shape when bonded to an electrode of a substrate electrode, and a gold bump forming method using the gold plating bath. A non-cyanide electrolytic gold plating bath for forming gold bumps according to the present invention, which comprises a gold sulfite base salt or a gold ammonium sulfite, a conductive salt, a crystal stabilizer, a crystal modifier, a buffering agent and a glossing agent, and The content of gold sulfite or ammonium sulfite is 1~20g/L, the conductive salt is sodium sulfite, the content is 5~150g/L, and the content of glossing agent is 0.5~100mmol/L. The above-mentioned glossing agent is preferably one or two or more compounds selected from the group consisting of anthraquinone and/or anthracene. |
| priorityDate | 2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.