abstract |
The present invention provides an anisotropic conductive adhesive composition, an anisotropic conductive adhesive film, and a semiconductor device. The anisotropic conductive adhesive composition comprises at least one resin selected from the group consisting of an acrylate-modified urethane resin and an ester urethane resin, an ethylene-vinyl acetate copolymer, and an isocyanuric acid. Ester acrylate, and a dicyclopentadiene (meth) acrylate. |