http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201331295-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_97730cc5065bbf9bf0a8e17abab99164
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-05
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
filingDate 2012-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fed5d9645f8632d001df2e30f57a4ff0
publicationDate 2013-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201331295-A
titleOfInvention Epoxy modified polyphenylene ether resin, resin composition and application thereof
abstract The present invention provides an epoxy-modified polyphenylene ether resin having a structural unit represented by the formula (I) and reacted as follows: a solid polyphenylene ether is obtained 100 parts of resin, add the polymerization solvent, dissolve into liquid polyphenylene ether resin solution, then add 5~60 parts of epoxy resin and 0.001~5 parts of catalyst, add to the solution, stir and mix at 80~140 °C for 1-3 hours A prepolymerized solution is obtained. The present invention also discloses resin compositions containing the epoxy-modified polyphenylene ether resin and their use in the preparation of printed circuit boards. The epoxy-modified polyphenylene ether resin composition of the invention has excellent impregnation property of glass fiber cloth, and has the advantages of simple preparation process, high efficiency, environmental protection, and high controllability of product purity. □
priorityDate 2011-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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